A Β C D

Aromatic glycidyl amine resins . . . 192. Β. Bis ( 2,3-epoxycyclopentyl ) ether and ethylene glycol, co polymer of. 87. Bisphenol-A, diglycidyl ether...
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Epoxy Resins Downloaded from pubs.acs.org by 185.251.14.111 on 08/06/18. For personal use only.

A Accelerated acid anhydride cured epoxy resins, kinetics of gela­ tion of 60 Accelerators, epoxy 37 Accelerators for epoxy-amine con­ densation reaction 29 Accelerators on the rates of phenyl glycidyl ether condensation, effect of 44 Acid copolymers 19 Additives for increased resin reactivity 57 Adhesion 109,119,122-3 Adhesives, dental 173 Adhesive strength 170 Aliphatic hydroxyl content, gel time vs 53,55 Aliphatic hydroxyl content vs. reac­ tivity of epoxy resins 57 Alkoxy functional siloxanes 71 Amide structure vs. reactivity . . . . 208 Amine condensation reaction, accelerators for epoxy29 Amine curing 3 agents, hydroxyl accelerators for epoxy resins with 49 Amine functional siloxanes as epoxy resin hardeners 70 Amine hardeners 90, 93 Anhydride curing 4 Aromatic glycidyl amine resins . . . 192

Β Bis ( 2,3-epoxycyclopentyl ) ether and ethylene glycol, co­ polymer of Bisphenol-A, diglycidyl ether of . . Butadiene—acrylonitrile copolymers, carboxyl and thiol-terminated Butadiene polymers, functionally terminated Butylamine

87 96 109 109 36

C Cab-O-Sil Carboxy containing polymers Carboxyl-terminated butadieneacrylonitrile copolymers . . . . Carboxy-terminated polyisobutylene-epoxy resin systems . . . .

152 141 109 108

Catalysts on the epoxy-amine reac­ tion, effect of 38,40 Chlorohydrin ester 18 Composites 219 Copolymer of bis (2,3-epoxycyclo­ pentyl) ether and ethylene glycol 87 CTPIB 108 curing reactions of 110 -epoxy compositions 109 -epoxy resin systems, electrical properties of 129 stress-strain relationship 115 plasticizers and fillers vs. stress-strain relationship of 118 Cure cycle 220 Cure mechanism 211 Cured epoxy resins, kinetics of gelation of accelerated acid anhydride 60 Curing agents, epoxy 9 Curing agents, latent epoxy resin 164 Curing conditions vs. reactivity . . 208 Curing reactions of C T P I B 110 0-Cyano glycidyl ether resins 191 Cycloaliphatic epoxide 87 Cycloaliphatic epoxy resins 134 for reinforced structures 86

D Dental adhesives 173 Dental restoratives 173 Dermatitis 17 DETA 98 DGEBA 96,134,177 DGER 178 Diafoams 150,154 epoxy 157-8 syntactic-air 155 syntactic-foamgrain 156 Diethylamine 36, 38 phenyl glycidyl ether37 Differential thermal analysis . . .209,212 Diglycidyl ether of bisphenol-A 96,134,174 Dilatant slurries 152 Dimethyltriphenyltrimethoxytrisiloxane 71 Diphenyldiethoxysilane 71 Dissolution of iron 145

228

E P O X Y

DMP-30 98 D P X100 2 DTA 209,212 Dynamic flexural fatigue 91 vs. toughness 92 Dynamic mechanical properties . . 96 Dynamic modulus 219

Ε Edgewise compressive strength . . 89 EEW 54 Electrical components 173 Electrical properties of C T P I B epoxy resin systems 129 Electrodeposition of surface coatings 140 Elongation 92 Encapsulant 133 Epichlorohydrin bisphenol 174 Epi-rez epoxy system 62 Epon 828 152 Epon epoxy system 62 Epoxies, fluorine-containing 8 Epoxies, fluoroaliphatic chains vs. water penetration of 14 Epoxy accelerators 37 amine condensation reaction, accel­ erators for 29 reaction, effect of catalysts on the 38,40 curatives 97 curing agents 9 media for foams 158 -polyamide 109 -polysulfide 109 resin curing agents, latent . . . . 164 resin hardeners, amine functional siloxanes as 70 resins aliphatic hydroxyl content vs. reactivity of 57 with amine curing agents, hy­ droxyl accelerators for . . 49 based on pentaerythritol, thermosetting 1 hydroxyl compounds vs 48 hydroxyl content in 57 for rapid room temperature cures 173 reactivity differences among liquid 52 for reinforced structures, cycloaliphatic 86 synthesis of 198 syntactic foams 158 Equi-viscosity curves 67 ERLA-4617 87 Ethylene glycol, copolymer of bis ( 2,3-epoxycyclopentyl ) ether and 87 Extracoordinate siliconate salts . . 164

RESINS

F Filler 136 Flexural strength and modulus . . . 81-2 Fluorinated epoxy resins 187 Fluorine-containing epoxies 8 Fluoroaliphatic chains vs. water penetration of epoxies 14 FMPDA 9 Foamed polyurethane 151 Foams lightweight epoxy 150 polyurethane vs. epoxy media for 158 syntactic 150-1 Functionally terminated butadiene polymers 109

G Gelation of accelerated acid anhy­ dride cured epoxy resins, k i ­ netics of 60 Gelation time vs. rate constant . . . 67-8 Gel time 49,168 vs. aliphatic hydroxyl content . . 53, 56 Glass-bubble reinforced foams . . . 150 Glass reinforced composites 91 Glycidyl acrylate 17 amides 192 crotonate 17 ester copolymers, process for . . 16 ether groups, replacing active hydrogens with . 203 ether of pentaerythritol 1 methacrylate 17 sulfonamides 192

H Hardener curing 4 Hardeners, amine functional silox­ anes as epoxy resin 70 Heat aging 124 Heat distortion temperature 76, 79 HHPA 98 Hydroxyl accelerators for epoxy resins with amine curing agents 49 compounds vs. reactivity of epoxy resins 48 content in epoxy resins 57

I Infrared analysis

209

Κ Kinetics of gelation of accelerated acid anhydride cured epoxy resins Kolbe reaction

60 145

L Latency Latent epoxy resin curing agents . . Lightweight epoxy foams

167 164 150

229

I N D E X

M Mass vs. setting time 175 Mechanical energy absorption characteristics 219 Mechanical properties, dynamic . . 96 Methylenedianiline 40 phenyl glycidyl ether39 Mobility factor 32 Modulus, flexural strength and . . . 81-2 Moisture resistance 131 Monofoams 157 MPDA 9,98

Ν Nitrogen-containing epoxy resins . .

192

Ο

Organophosphorus-nitrogen compounds Organosilicon derivatives Oxidation of hydroxyl ion Oxirane ring Ozonization

208 164 145 29 109

Ρ Pentaerythritol glycidyl ether of 1 polyglycidyl ether of 2 thermosetting epoxy resins based on 1 Phenyl glycidyl ether condensation, effect of acceler­ ators on the rates of 44 -diethylamine 37 -methylenedianiline 39 Phosphorus amide cured epoxy resins 208 Phosphorus amide epoxy blends . . 209 Phthalated epoxy ester 141 Plasticizers vs. stress-strain relation­ ship of CTPIB-epoxy systems 118 PMDA 98 Polycarbonates 98,101,103 Polyglycidyl ether of penta­ erythritol 2 Polysulfide polymers 109 Polyurethane, foamed 151 Polyurethane media for foams . . 158 Premix 60 Primary amines 173 Process for glycidyl ester copolymers 16

R Rapid room temperature cures, epoxy resins for 173 Rate constant, gelation time vs. . . 67-8 Rate constant vs. reciprocal temperature 66 Reaction mechanism 212

Reactivity additives for increased resin . . . differences among liquid epoxy resins of epoxy resins, aliphatic hy­ droxyl content vs of epoxy resins, hydroxyl com­ pounds vs Reciprocal temperature, viscosity

vs

57 52 57 48

64-5

Reciprocal temperature, rate con­ stant vs 66 Reinforced structures, cycloali­ phatic epoxy resins for 86 Replacing active hydrogens with glycidyl ether groups 203 Resin-hardener melt, viscosity of . . 60 Resin-starved foams 154 Resin structure vs. reactivity 208 Resistance to water 83-4,93,127 Restoratives, dental 173

S Setting time, mass vs 175 Siliconate salts, extracoordinate . . 164 Siloxanes, alkoxy functional 71 Siloxanes as epoxy resin hardeners, amine functional 70 Small masses 173 Strength and modulus, flexural . . 81-2 Stress-strain relationship of CTPIB-epoxy resin systems . . 115 plasticizers and fillers vs 118 Stretch induced mobility 102 Styrofoam 151 Surface coatings, electrodeposition of 140 Sylkyd 50 71 Syntactic -air diafoams 155 -foamgrain diafoams 156 foams 150-1,161-2 Synthesis of epoxy resins 198

Τ Tan δ vs. temperature 74^5,79 Telechelic prepolymers 108 Tertiary amines 43-4, 87 TGEP 179 Thermal degradation 83 Thermomechanical analysis 209,218 Thermosetting epoxy resin based on pentaerythritol 1 Thiol-terminated butadiene-acrylonitrile copolymers 109 TMA 209,218 Toughness vs. dynamic flexural fatigue 92 0-Transition mechanism 96 Triazine-based epoxy resins 194 2,4,6-Trichlorophenol accelerator.. 45 /3-Trifluoromethyl glycidyl ether resins 189

230

E P O X Y

U Urethane elastomers

109

Voltammetry VRA

RESINS

141 209,219

V

W

Vibrating reed analysis 209,219 Versamid 125 152 Viscosity curves, equi67 Viscosity of resin-hardener melt . . 60 Viscosity vs. reciprocal temperature 64-5

Water penetration of epoxies, fluoroaliphatic chains vs 14 Water resistance 83-4, 93,127 Water sensitivity of 1,4-cyclohexane diepoxide 9