The American Chemical Society Presents The Premier, International Journal for Chemists, Chemical Engineers, and Materials Scientists and Technologists
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Editor: Leonard V. Interrante, Rensselaer Polytechnic Institute Associate Editors: Dennis W. Hess, University of California, Berkeley; Gary E. Wnek, Rensselaer Polytechnic Institute
Indispensable, bimonthly coverage What are the latest directions in materials chemistry? New materials? Preparation, characterization, and processing science and technology? In bimonthly issues, CHEMISTRY OF MATERIALS provides a valuable, molecular-level perspective at the interface of chemistry, chemical engineering, and materials science. Communications and short reviews round out its publication of original research. CHEMISTRY OF MATERIALS examines, in depth: • Synthesis and investigation of inorganic and organic solid state materials (coverage encompasses studies of molecular precursor routes to nonmolecular, inorganic solids); • Investigation of polymeric solids and thin films, and their potential application as structural, optical, or electronic materials; • Preparation and processing, particularly by chemical means, of electronic and optical materials and devices.
Guided by a prestigious, international panel of chemists, CHEMISTRY OF MATERIALS delivers a timely turnaround of manuscripts. Interested in submitting your work? Write Dr. Leonard V. Interrante, Dept. of Chemistry, Rensselaer Polytechnic Inst., Troy, NY 12180-3590 U.S.A. (518/276-2644). 1990 Subscription Rates Members* Non-Member One Year Two Years One Year $49 $88 $299 $ 57 $ 65
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May 14, 1990 C&EN
Editorial Advisory Board H.R Allcock, Penn. State U. · S Andersson. U. Lund. Sweden · N. Armstrong. U. Ariz. · Ν Bartlett. UCB· G. Blasse. U Utrecht. The Netherlands · J. Bnnker. Sandia Nat. Labs · P. Cassoux. CNRS. Toulouse. France · J Corbett. Iowa State U · Τ Davidson. U. Conn. · F.J Di Salvo. Cornell U. · G.C Farnngton. U Penn · JE. Frommer. IBM· W. Gladfelter. U Minn. · M. Grunze. U. Heidelberg. W. Germany· R Hoffmann. Cornell U. · A. Jacobson. Exxon · K. Jensen. MIT· Ε Kay. IBM· Κ Kitazawa. U. Tokyo. Japan · Κ Klabunde. Kansas State U. · W. Klemperer. U. III. · B. Kowalski. U Wash · J. Lando. Case Western Res. · L.D Laude. U. de ΙΈ tat. Belgium · J. Livage. U. Pans VI. France · Τ Marks. Northwestern U. · R Messmer. GE CRD · J. Miller, du Pont · J Moore. RPI · D. Murphy. Bell Labs. · R Murray. U. N. Carolina · D Nelson. NSF· Ν Ogata. Sophia U.. Japan · G.A. Ozm. U. Toronto. Canada · T. Pmnavaia. Mich. State U · K. Poeppelmeier. Northwestern U. · J. Rouxel. Inst, des Matériaux. France· Β. Scott. IBM· D. Seyferth. MIT· D Shriver. Northwestern U. · A. Sleight. Oregon State U. · R. Snnivasan. IBM· M. Steigerwald. Bell Labs · G.D. Stucky. UCSB*S. Suib. U. Conn. · E. Thomas. MIT· J.M. Thomas. Royal Inst. G.B.. U.K. · L. Thompson. Bell Labs. · B. Tofield. Johnson Matthey. U.K. · D. Ulrich. AFOSR · S. Veprek. U. Munchen. W. Germany · S. Viticoli, CNR, Rome. Italy H.G. von Schnering, Max-Planck Inst.. W. Germany· S. Whittingham. SUNY. Bmghamton · D. Williams. Eastman Kodak Co. · J. WHIiams. Argonne Nat. Lab. · S. Williams. UCLA · C.G. Willson. IBM· A. Wold. Brown U. · M. Wrighton. MIT· F. Wudl. UCSB· Ρ Zanella. CNR. Padova. Italy
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