Correction to Uniform and Ordered Copper Nanomeshes by

Tongchuan Gao, Baomin Wang, Bo Ding, Jung-kun Lee, and Paul W. Leu*. Nano Lett. , 2014, 14 (6), pp 3694–3694. DOI: 10.1021/nl501687p. Publication Da...
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Addition/Correction pubs.acs.org/NanoLett

Correction to Uniform and Ordered Copper Nanomeshes by Microsphere Lithography for Transparent Electrodes Tongchuan Gao, Baomin Wang, Bo Ding, Jung-kun Lee, and Paul W. Leu* Nano Lett. 2014, 14 (4), 2105−2110. DOI: 10.1021/nl5003075

F

igure 3 in our paper should be the following, instead of the Table of Contents image.

Figure 3. (a) Schematic of the Cu NM fabrication process. (b) Scanning electron microscopy (SEM) images of fabricated Cu NM with a = 1300 nm, w = 150 nm, and t = 40 nm on a rigid substrate. (c) Optical image of a Cu NM fabricated directly on a flexible polyethylene terephthalate (PET) substrate. SEM images show the Cu NM at four various locations.

Published: May 7, 2014 © 2014 American Chemical Society

3694

dx.doi.org/10.1021/nl501687p | Nano Lett. 2014, 14, 3694−3694