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Applications of Polymer, Composite, and Coating Materials
Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future Electronics Chang Ping Feng, Li-Bo Chen, Guo-Liang Tian, Shen Shen Wan, Lu Bai, Rui-Ying Bao, Zhengying Liu, Ming-Bo Yang, and Wei Yang ACS Appl. Mater. Interfaces, Just Accepted Manuscript • Publication Date (Web): 26 Apr 2019 Downloaded from http://pubs.acs.org on April 26, 2019
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ACS Applied Materials & Interfaces
Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future Electronics Chang-Ping Feng#, Li-Bo Chen#, Guo-Liang Tian, Shen-Shen Wan, Lu Bai, Rui-Ying Bao, Zheng-Ying Liu, Ming-Bo Yang, Wei Yang* College of Polymer Science and Engineering, Sichuan University, State Key Laboratory of Polymer Materials Engineering, Chengdu, 610065, Sichuan, People’s Republic of China. #Chang-Ping Feng and Li-Bo Chen contributed equally to this work.
ABSTRACT Thermal management materials (TMMs) used in electronic devices are crucial for future electronics and technologies such as flexible electronics and artificial intelligence (AI) technologies. As future electronics will work in a more complicated circumstance, the overheating and overcooling problems can exist in the same electronics while the common TMMs cannot meet the demand of thermal management for future electronics. In this work, nacre mimetic graphene based films with super flexibility and durability (in over 10,000 tensile cycles), excellent capability to dissipate excess heat (20.84 W/(m∙K) at only 16-22 μm thickness) and outstanding heating performance to generate urgent heat for electronics under extremely cold conditions, are fabricated by a facile solution casting method, and the fabricated composites are proved to be superior multifunctional TMMs for the thermal management in electronic chips. In addition, the application of the paper-like films with high inplane thermal conductivity for flexible heat spreader and film heater is demonstrated by simulation using a finite volume method, which shows the high importance of the in-plane thermal conductivity in thermal management of electronics. KEYWORDS: Thermal conductivity; thermal management materials; film heater; finite volume method; future electronics
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INTRODUCTION Effective thermal management plays a vital role in the development, performance and reliability of a wide variety of electronic devices.1-5 Common thermal management materials (TMMs) including thermal interface materials (TIMs), heat spreaders, phase change materials (PCMs) and thermally conductive gap filling materials, are capable of transferring, dissipating or storing excess heat from electronic devices at high temperature to prevent the overheating of electronic devices. 6-11
However, with the rapid development of future electronic devices in industries such as
militaries, aircrafts and computers among many others, it is urgently needed to develop flexible multifunctional TMMs with excellent capability to control the electronic device temperature instead of just dissipating heat. 12-16 At present, most researches focus on the overheating problem of electronic devices,17 while ignoring that the working reliability of electronic devices in harsh environments such as in deep space and oceans, south pole and other high latitude areas, etc.18 For example, the working temperature of electronics assembled in robots must be maintained in a normal range when robots are being designed to perform exploration missions in harsh environment.19 The energy and power of lithium ion batteries decrease rapidly when the temperature falls to below 10 º C,20 and the mobile phones shut down automatically in extreme cold conditions (
