Preface
Downloaded by 207.118.7.102 on March 16, 2018 | https://pubs.acs.org Publication Date: October 31, 1989 | doi: 10.1021/bk-1989-0412.pr001
X R O G R E S S IN MICROELECTRONICS, and especially in microlithographic
technology, is proceeding at an astonishing rate. Today, it is believed that conventional photolithography, which uses 365-405-nm radiation, will be able to print 0.5-0.6-μπι features in production and that it will remain the dominant printing technology well into the 1990s. Diazonaphthoquinone-novolac materials will most likely remain the materials of choice for production of these devices. The costs of introducing new resist materials and new hardware are strong driving forces pushing photolithography to its absolute limit The technological alternatives to conventional photolithography are largely the same as they were a decade ago, that is, deep-UV photolithography, scanning electron-beam lithography, and X-ray lithography. The leading candidate for the production of devices with features as small as 0.3 μτα is deepU V lithography. No matter which technology eventually replaces photolithography, the new resists and processes that will be required will necessitate an enormous investment in research and process development. The polymer materials that are used as radiation-sensitive resist films must be carefully designed to meet the specific requirements of the lithographic technology and device process. Although these requirements vary according to the radiation source and device process, properties such as sensitivity, contrast, resolution, etching resistance, shelf life, and purity are ubiquitous. This volume is not intended to be comprehensive, but the chapters found here should provide the reader with an appreciation for the diversity of chemical research efforts that are required for the development of new resist materials and processes. They span the range of novel synthetic reactions that may be applied to imaging processes, to new processing techniques to enhance image quality, to understanding the fundamental science behind processes such as polymer dissolution and photoablation. The contents have been divided into three sections: Chemically Amplified Resist Chemistry, Multilevel Resist Chemistry and Processing, and Novel Chemistry and Processes for Microlithography. Each section contains an introduction written by a recognized expert in the field. xi
Reichmanis et al.; Polymers in Microlithography ACS Symposium Series; American Chemical Society: Washington, DC, 1989.
Acknowledgments We are indebted to many people and organizations for making the symposium and book possible, particularly the authors, for their efforts in providing manuscripts of their presentations. We are especially grateful to the Petroleum Research Fund and the Division of Polymeric Materials: Science and Engineering for financial support. Finally, our sincerest thanks are extended to Cheryl Shanks and the production staff of the A C S Books Department for their efforts in publishing this volume.
Downloaded by 207.118.7.102 on March 16, 2018 | https://pubs.acs.org Publication Date: October 31, 1989 | doi: 10.1021/bk-1989-0412.pr001
ELSA
REICHMANIS
AT&T Bell Laboratories Murray Hill, NJ 07974 SCOTT A. MACDONALD
IBM Almaden Research Center San Jose, CA 95120-6099 TAKAO
IWAYANAGI
Hitachi Central Research Laboratory Kokubunji, Tokyo 185, Japan July 31, 1989
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Reichmanis et al.; Polymers in Microlithography ACS Symposium Series; American Chemical Society: Washington, DC, 1989.
