Ind. Eng. Chem. Res. 2011, 50, 785–790
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Preparation and Thermal Properties of the UV-Cured Epoxy Acrylate/ Microencapsulated Phase-Change Material Ping Zhang,† Lei Song,† Kang Dai,† Xueying Shan,†,‡ Hongdian Lu,†,§ Jian Wang,*,† and Yuan Hu*,† State Key Laboratory of Fire Science, UniVersity of Science and Technology of China, 96 Jinzai Road, Hefei, Anhui 230026, People’s Republic of China, Department of Chemistry, UniVersity of Science and Technology of China, 96 Jinzai Road, Hefei 230026, People’s Republic of China, and Department of Chemical and Material Engineering, Hefei UniVersity, Hefei, Anhui, 230022, People’s Republic of China
This paper presents a new type of flame-retardant ultraviolet (UV)-cured epoxy acrylate (EA) that contains microencapsulated phase-change materials (Micro-PCM); the Micro-PCM, which is based on a paraffin core and a melamine-formaldehyde (MF) shell, was synthesized via an in situ polymerization method. To improve the thermal stability of the UV-cured EA/Micro-PCM composite, dimethyl methyl phosphonate (DMMP), with or without octavinyl polyhedral oligomeric silsesquioxane (OVPOSS), was introduced into it. The MicroPCM properties were characterized by scanning electron microscopy (SEM), Fourier transform infrared spectrometry (FTIR), differential scanning calorimetry (DSC), and thermogravimetric analysis (TGA); the results showed that the MF was successfully fabricated on the surface of the core material, and the MicroPCM contained ∼70 wt % core material. The thermal stabilities of the UV-cured EA/Micro-PCM composites and the flame-retardant UV-cured EA/Micro-PCM composites were evaluated by microscale combustion calorimetry (MCC) and TGA, and the results indicated that, when the content of Micro-PCM is
