Stabilization of Alumina Slurry for Chemical− Mechanical Polishing of

Langmuir 1996, 12, 3563-3566

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Stabilization of Alumina Slurry for Chemical-Mechanical Polishing of Copper Q. Luo,† D. R. Campbell,‡ and S. V. Babu*,†,‡ Department of Chemical Engineering and Center for Advanced Material Processing, Clarkson University, Potsdam, New York 13699 Received January 19, 1996. In Final Form: April 23, 1996X Stabilization of alumina slurries containing Fe(NO3)3 and benzotriazole (BTA) for chemical-mechanical polishing (CMP) of copper in acidic media was investigated. Slurry stability was evaluated from the initial settling rate of alumina particles in well-dispersed slurries. ζ potential and FTIR spectroscopy were employed to elucidate the observed effects. Fe3+, used as an etchant for copper, did not affect the slurry stability significantly, especially at low concentrations (