C&EN
ΛPolymer Materials
^
for Electronic Applications Current research on resist material, polyimide dielectrics in encapsulation, and the chemistry of epoxy resins This 17-chapter volume focuses on the chemical aspects of polymer materials for electronic applications, including mech anisms of formation and utilization, and stability and reliability of these materials. CONTENTS Methacrylate Electron Resist · Poly(butene1-sulfone) · Deep UV Photoresist · Terpolymer Photoresist · Vinyl Poylmers and Photoresists · ACS Symposium Poly(/V-alkyl-o-nitroamides) · High-Resolution Lithography · Polyimide for Multilevel VLSI · Series No. 184 Polyimide Coatings · Polyimide Isoindoloquinazolinedione · Polyimide Films for Semicon Eugene D. Feit, ductors · Polyimide Films in Integrated Circuits Editor • Silicone Elastomers · Branched Epoxy Re Harris sins · Cured Epoxy Powder Coatings · Poly Semiconductor mers for Molded IC Devices · Semiconducting Group Organic Thin Films Cletus W. Wilkins, 256 pages (1982) Clothbound Jr., Editor Export $41.95 Beil Laboratories US & Canada $34.95 LC 82-1670 ISBN 0-8412-0715-1 Based on a Order from: symposium sponsored by the Distribution Office- 34 Division of OrganicAmerican Chemical Society 1155 Sixteenth St., N.W. Coatings and Plastics Chemistry Washington, D.C. 20036 of the American or CALL TOLL FREE 800-424-6747 Chemical Society. and use your credit card.
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