Polymer Materials for Electronic Applications - C&EN Global

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ΛPolymer Materials

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for Electronic Applications Current research on resist material, polyimide dielectrics in encapsulation, and the chemistry of epoxy resins This 17-chapter volume focuses on the chemical aspects of polymer materials for electronic applications, including mech­ anisms of formation and utilization, and stability and reliability of these materials. CONTENTS Methacrylate Electron Resist · Poly(butene1-sulfone) · Deep UV Photoresist · Terpolymer Photoresist · Vinyl Poylmers and Photoresists · ACS Symposium Poly(/V-alkyl-o-nitroamides) · High-Resolution Lithography · Polyimide for Multilevel VLSI · Series No. 184 Polyimide Coatings · Polyimide Isoindoloquinazolinedione · Polyimide Films for Semicon­ Eugene D. Feit, ductors · Polyimide Films in Integrated Circuits Editor • Silicone Elastomers · Branched Epoxy Re­ Harris sins · Cured Epoxy Powder Coatings · Poly­ Semiconductor mers for Molded IC Devices · Semiconducting Group Organic Thin Films Cletus W. Wilkins, 256 pages (1982) Clothbound Jr., Editor Export $41.95 Beil Laboratories US & Canada $34.95 LC 82-1670 ISBN 0-8412-0715-1 Based on a Order from: symposium sponsored by the Distribution Office- 34 Division of OrganicAmerican Chemical Society 1155 Sixteenth St., N.W. Coatings and Plastics Chemistry Washington, D.C. 20036 of the American or CALL TOLL FREE 800-424-6747 Chemical Society. and use your credit card.

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