SILVER PLATING FROM AN IODIDE COMPLEX
( A m
Submiltrrl blj: Saul L. Geffner, Forest Hills High School, iYew York Checked by: .Tulian R. Rmndou, Rlirhigari State University
PREPARATION
Prepare the complex solution by the addition of sstrwated KI solotion to a 0.5 If (approximate) AgKOl solr~tionuntil all AgI just dissolves. Provide a small porous cup, a '/,-in. graphite rod anode, a source of controlled enif ( 0 3 v is snfficient for small objects) and a dean item to be platrd. DEMONSTRATION
With the anode in place within the porous cnp and the ohjert to he plated as the cathode, electrolyze the
solution for several minutes a t a current density of approximately 0.1 amp/in.? of surface. Plating is clearly visible as it forms in the clear solotion and may be rarefnlly b~rffedto a metallic hlster. REMARKS
The porous cup serves to prevent contamination of t,he plating solution by free iodine. This cell operates nearly as well as the t,oxic cyanide complex system and with murh less danger. As in all plating procedures. current densit,y and surfare conditions greatly affect the rlnslity of the plating.
Journal of Chemzcni E d w a l i o n
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Jsnc 1981
