BOOK REVIEWS F. It. Shsnlcy surveys the correlations avsilnhle to the engineer for use in design of structural systems a t higher temperatures where time dependent effects must he considered. References to more extensive literature sources are given. Thus thc introductory chapter may serve as a, rovier for the student whose background includes a prior course in stress analysis. Alternatively, it may serve as a. survey chapter augmented I?? more intensive coverage of supplemental material by the inntructor. In the succeeding chapters attention is centeredon plastic deformnt,ion. Content of the book is not limit,ed to elevated temperature phenomena. I n particular,
the early section of the hook contains chapters on the nature of dislocations, h e havior of dislocetions, and thermodynamic properties. Figures illustrating crystal defects are quite clear. The middle chapters in the book include coverage of theories of creep, mechanism of fracture, and theories of fatigue. Succeeding chapters are on mare specialized topics. Chapters eight and nine discuss experimental evaluation of creep and stress rupture and the role of grain boundaries in these phenomena. These and the final chapters in the hook are better documentod than the earlier material, though perhaps necessarily so because of the greater emphasis here on experimental investigations. The book concludes with chapters an alloying for creep resistance, on mechanical properties of ceramic materials. on deformation
phenomena, on thermal stresses and thermal shock, on unsteady state creep, and on damping and resonance fatigue. As a reference book for the instructor or for students' supplemental reading " M e chanical Behavior" can be recommended. Literature references through 1959 are eked by the various authors, and the book contains both an author and a subject index. The suitability of "Mcchsnical B e havior of Materials a t Elevated Temperatures" as s. textbook will depend very much upon instructional needs. For the instructor possessing already extensive lecture notes the book may suffice far the students' supplementary reading. For a newly organized course, a text with a. more definite outline may be needed as a primary text.
M. M. G ~ E S O N Harueu Mudd College Claremont, California
The Chemical Formulary.
Volume 11
Edited by H . Bennett, Cheminform Instit,ute. Chemical Publishing Co., Inc., New York, 1961. 416 pa. Tables. 14.5 X 22.5 em. $8. Hundreds of new recipes me included in this latest addition to the well-known series. This work belongs in libraries ~vililableto acsdcmic chemists who get asked such questions as, "How can I make R mothproofing mlution?"
W. F. I
